| 摘要 |
In the semiconductor module comprising a package substrate, a first semiconductor package, and a semiconductor bare chip, such problems as the occurrence of a wire short caused by warpage of the first semiconductor package and non-filling and the like at the time of resin sealing can be solved. A semiconductor module (10), having: a semiconductor package (6), which is obtained by mounting and resin-sealing a semiconductor bare chip (1) on a first package substrate (4); a semiconductor bare chip 2; and a second package substrate (12), the semiconductor module being characterized in that the semiconductor package (6) is mounted on the second package substrate (12) and the semiconductor bare chip (2) is mounted on the semiconductor package (6). |
