| 摘要 |
The present invention relates to a soldering iron used to solder a component onto a substrate. The soldering iron includes a tip part which melts lead and has a bent portion in contact with the lead; and a tip holder part which has a heater heating the tip part. The purpose of the present invention is to provide the solder iron with a new tip part. Further, another purpose of the present invention is to provide the solder iron for efficiently performing soldering and reducing defects due to soldering. |
