发明名称 Preparing substrates containing polymers for metallization
摘要 <p>Methods of swelling and topographically altering polymers of substrates using low foaming compositions are disclosed. Solvent swells which are stable, homogeneous and low foaming are applied to substrates containing polymers to swell and soften the polymers followed by applying an oxidizer to topographically alter and desmear the polymers in preparation for metallization of the substrate.</p>
申请公布号 EP2287357(A3) 申请公布日期 2014.09.24
申请号 EP20100173029 申请日期 2010.08.17
申请人 ROHM AND HAAS ELECTRONIC MATERIALS, LLC 发明人 LI, CRYSTAL P.L;YEE, DENNIS K. W.;TANG, MICHAEL CY
分类号 C23C18/16;C08J7/02;C23C18/04;C23C18/20;C23C18/24;C23C18/28;C23C18/30;C23C18/40 主分类号 C23C18/16
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