发明名称 |
Preparing substrates containing polymers for metallization |
摘要 |
<p>Methods of swelling and topographically altering polymers of substrates using low foaming compositions are disclosed. Solvent swells which are stable, homogeneous and low foaming are applied to substrates containing polymers to swell and soften the polymers followed by applying an oxidizer to topographically alter and desmear the polymers in preparation for metallization of the substrate.</p> |
申请公布号 |
EP2287357(A3) |
申请公布日期 |
2014.09.24 |
申请号 |
EP20100173029 |
申请日期 |
2010.08.17 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS, LLC |
发明人 |
LI, CRYSTAL P.L;YEE, DENNIS K. W.;TANG, MICHAEL CY |
分类号 |
C23C18/16;C08J7/02;C23C18/04;C23C18/20;C23C18/24;C23C18/28;C23C18/30;C23C18/40 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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