发明名称 Adhesive injection apparatus and method
摘要 <p>Adhesive injection apparatus, designed to inject an adhesive (E) into gaps between a plurality of layers of flat plate members (25), includes: a receptacle (18) for holding therein the flat plate members; an evacuation section (19) for evacuating the interior of the receptacle and the gaps between the flat plate members; an adhesive supply section (12) for supplying the adhesive into the receptacle; and a gas introduction section (20) for introducing a gas into the receptacle to produce a pressure difference between the interior of the receptacle and the gaps between the flat plate members, so as to allow the adhesive to be injected from all around the flat plate members into the gaps.</p>
申请公布号 EP1624477(B1) 申请公布日期 2014.09.24
申请号 EP20050016801 申请日期 2005.08.02
申请人 HONDA MOTOR CO., LTD. 发明人 MIYAKAWA, NOBUAKI;NAKAMURA, NATSUO;KIMURA, TAKAHIRO;TOSHIMA, HIROYUKI
分类号 H01L21/67 主分类号 H01L21/67
代理机构 代理人
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