METHOD OF FABRICATING SEMICONDUCTOR STACK STRUCTURES

摘要

Described is a method of fabricating a multi-chip stack package which includes preparing a single body lower chip substrate which has a first surface and a second surface facing the first surface, forming a single body substrate-chip bonding structure by bonding unit package substrates onto the first surface of the single body lower chip substrate, separating unit substrate-chip bonding structures from the single body substrate-chip bonding structure, preparing a single body upper chip substrate, forming a single body semiconductor chip stack structure by bonding the unit substrate-chip structures on the upper surface of the single body upper chip substrate, and separating the unit semiconductor chip stack structures from the single body semiconductor stack structure.