发明名称 Heat-curable silicone resin sheet having phosphor-containing layer and phosphor-free layer, method of producing light emitting device utilizing same and light emitting semiconductor device obtained by the method
摘要 Provided is a heat-curable silicone resin sheet that is able to easily uniformly disperse phosphors on an LED element surface, a method of producing a light emitting device utilizing the same and an encapsulated light emitting semiconductor device obtained by the method utilizing the same. The heat-curable silicone resin sheet includes at least the two layers of a layer 1 including a heat-curable silicone resin composition containing phosphors that is in a plastic solid state or a semi-solid state at room temperature, and a layer 2 including a transparent or a semi-transparent heat-curable silicone resin composition that is in a plastic solid state or a semi-solid state at room temperature.
申请公布号 US8841689(B2) 申请公布日期 2014.09.23
申请号 US201313742794 申请日期 2013.01.16
申请人 Shin-Etsu Chemical Co., Ltd. 发明人 Kashiwagi Tsutomu;Tanaka Hayato;Shiobara Toshio
分类号 H01L33/00 主分类号 H01L33/00
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A heat-curable silicone resin sheet comprising: a layer (2) including a heat-curable silicone resin composition containing phosphors that is in a plastic solid or semi-solid state at room temperature; and a layer (1) including a heat-curable silicone resin composition containing essentially no phosphors that is in a plastic solid or semi-solid state at room temperature, wherein the layer (2) includes the heat-curable silicone resin composition containing: (A-1) a resin-structured organopolysiloxane consisting essentially of R1SiO1.5 units R22SiO units, and R3aR4bSiO(4-a-b)/2 units, wherein R1, R2, and R3 each independently represent a methyl group, an ethyl group, a propyl group, a cyclohexyl group, or a phenyl group, R4 independently represents a vinyl group or an allyl group, a represents 0, 1, or 2, b represents 1 or 2, a+b is either 2 or 3, and at least a portion of the R22SiO units are consecutively repeated, with a number of the repetitions in a range of 5 to 300; (B-1) a resin-structured organohydrogenpolysiloxane consisting essentially of R1SiO1.5 units, R22SiO units, and R3cHdSiO(4-c-d)/2 units, wherein R1, R2, and R3 each independently represent the groups as defined above, c represents 0, 1, or 2, d represents 1 or 2, c+d is either 2 or 3, and at least a portion of the R2,SiO units are consecutively repeated, with a number of the repetitions in a range of 5 to 300, wherein a molar ratio of hydrogen atoms bonded to silicon atoms within component (B-1) with respect to the sum of the vinyl groups and the allyl groups within component (A-1) is in a range of 0.1 to 4.0; (C-1) an effective amount of at least one platinum group metal based catalyst for curing; and (D) at least one phosphor, and the layer (1) includes the heat-curable silicone resin composition containing essentially no phosphors, the composition containing: (A-2) a resin-structured organopolysiloxane consisting essentially of R1SiO1.5 units R2,SiO units, and R3aR4bSiO(4-a-b)/2 units, wherein R1, R2, and R3 independently represent a methyl group, an ethyl group, a propyl group, a cyclohexyl group, or a phenyl group, R4 independently represents a vinyl group or an allyl group, a represents 0, 1, or 2, b represents 1 or 2, a+b is either 2 or 3, and at least a portion of the R22SiO units are consecutively repeated, with a number of the repetitions in a range of 5 to 300; (B-2) a resin-structured organohydrogenpolysiloxane consisting essentially of R1SiO1.5 units, R22SiO units, and R3cHdSiO(4-c-d)/2 units, wherein R1, R2, and R3 each independently represent the groups as defined above, c represents 0, 1, or 2, d represents 1 or 2, c+d is either 2 or 3, and at least a portion of the R22SiO units are consecutively repeated, with a number of the repetitions in a range of 5 to 300, wherein a molar ratio of hydrogen atoms bonded to silicon atoms within component (B-2) with respect to the sum of the vinyl groups and the allyl groups within component (A-2) is in a range of 0.1 to 4.0; and (C-2) an effective amount of at least one platinum group metal based catalyst for curing.
地址 Chiyoda-ku JP