Soldering relief method and semiconductor device employing same

摘要

A semiconductor device includes a substrate having a first side and a second side, the second side having a mounting location for at least one semiconductor element, and the first side having a plurality of locations electrically connected to locations on the second side. A plurality of electrically conductive interconnects are provided at the locations, each having a first end attached at the location and a second end spaced from the substrate, and an encapsulant partially encapsulates the plurality of interconnects and has a surface lying in a first plane. The second ends are located on the side of the first plane opposite from the substrate first side, an annular space in the encapsulant surrounds each of the plurality of electrically conductive interconnects, and the annular space has a bottom located between the first plane and the substrate first side. Also a method for making such a semiconductor device.

主权项

1. A method of forming a semiconductor device comprising:
providing a substrate having a top side having a mounting location for at least one semiconductor element and a bottom side having a plurality of locations electrically connected to locations on said top side; forming a plurality of electrically conductive interconnects at the plurality of locations on the bottom side; at least partially encapsulating, with an encapsulant, the plurality of electrically conductive interconnects without completely encapsulating the interconnects; and removing a portion of the encapsulant adjacent to each of the interconnects to expose previously encapsulated portions of the interconnects while leaving portions of the interconnects adjacent to the bottom side encapsulated by the encapsulant, wherein removing a portion of the encapsulant comprises forming an annular region in the encapsulant around the at least one of the solder balls, the annular region having a flat bottom parallel to or lying in a plane parallel to the bottom side.