| 摘要 |
Explained is a semiconductor package including a magnetic core inductor (MCI) structure for an integrated voltage regulator. In an embodiment, a semiconductor package comprises a semiconductor substrate, and a semiconductor die combined on a first surface of the semiconductor package. The semiconductor die has a plurality of metal-insulator-metal (MIM) capacitor layers thereon. The semiconductor package also includes a magnetic core inductor (MCI) die combined on a second surface of the package substrate. The magnetic core inductor (MCI) die includes equal to or more than one slotted inductor, and has a plurality of metal-insulator-metal (MIM) capacitor layers thereon. |
