| 摘要 |
A precursor for polyimide is provided to ensure excellent operability due to low molecular weight, remarkable thermal property, mechanical property and tensile strength and to achieve a smoothing effect in coating. A precursor for polyimide has a structure of the following chemical formula (1). In the chemical formula (1), R is linear or branched alkyl having C1-14, aryl or aralkyl having C6-14, or ethylene unsaturated group; Rx independently shows H or ethylene unsaturated group; G independently shows tetravalent organic radical; P independently shows divalent organic radical; and m is an integer of 0-100. |
