发明名称 THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION
摘要 <p>According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.</p>
申请公布号 KR101442717(B1) 申请公布日期 2014.09.23
申请号 KR20107012427 申请日期 2008.09.04
申请人 发明人
分类号 B05C5/00;B32B7/02;B32B15/08;B32B27/16 主分类号 B05C5/00
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