| 摘要 |
The present invention relates to a method for manufacturing a module using a surface acoustic wave element and a module using the same. The method is capable of manufacturing a low price, miniaturized and high reliable module by simplified processes using an insulating packing member when a surface acoustic wave element having a hollow structure is manufactured as a module on a single mounting substrate along with other elements. The module using a surface acoustic wave element comprises: a surface acoustic wave element including an IDT electrode unit formed on a substrate to generate a surface acoustic wave, multiple pads formed to be spaced apart from the IDT electrode unit, an insulation film to have a first opening to expose a portion of the pads, a column unit formed between the IDT electrode unit and the pads, a roof unit mounted on the column unit to form a dome having a hollow along with the column unit, and a wetproof protection film deposited to cover the insulation film and the roof unit; bumps which are respectively formed on the pads at a certain height; a PCB which is mounted on the bumps to face the IDT electrode unit by flip-chip bonding; and an insulating packing member to cover all of the surface acoustic wave element including the bumps from the PCB substrate. |
