| 摘要 |
PROBLEM TO BE SOLVED: To provide a cyanide-free tin alloy plating solution having excellent temporal stability, and to provide a method of precipitating tin alloy plating onto an electroconductive object using the tin alloy plating solution.SOLUTION: A tin alloy plating solution contains tin ions and one or more other metal ions selected from the group consisting of silver, copper, bismuth, indium, palladium, lead, zinc, and nickel, and further contains peptides with cysteine residues. |
