| 摘要 |
PROBLEM TO BE SOLVED: To provide a high reliability humidity sensor including a monolithic IC for detecting a humidity change as a resistance change using a stress change due to moisture absorption of mold resin.SOLUTION: The humidity sensor of the present invention is formed by mounting a semiconductor element on a lead frame and encapsulating the semiconductor element with resin. An integrated circuit (monolithic IC) 2 is formed integrally on a silicon wafer, and a first resistance element 4 is formed on the integrated circuit 2. Mold resin 3 is formed so as to cover the integrated circuit 2 and the first resistance element 4. This configuration allows humidity detection on the basis of a resistance change rate of the first resistance element 4 to a predetermined moisture absorption rate of the mold resin 3. |
