| 摘要 |
PROBLEM TO BE SOLVED: To provide chamber apparatus excellent in performance of adjusting an environment of a periphery of a substrate and to provide a heating method.SOLUTION: The chamber apparatus includes: a chamber that houses a substrate on which a coating film is formed; a first heating part that is housed in the chamber and is disposed on a first surface side of the substrate; a second heating part that is housed in the chamber and is disposed on a second surface side of the substrate that is opposite to the first surface; and a pressure adjusting part that is capable of raising and reducing pressure inside the chamber in a state of being heated. |
