发明名称 WIRE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To efficiently process a wire, in a wire processing device, without performing an avoiding operation on a suction tube after terminal processing.SOLUTION: As a cutter unit 5, there are provided a wire cutting blade 5C for cutting a wire 50 supplied from a wire supply section and a pair of strip blades 5F and 5R which are cut into and strip coatings of terminal portions of the wire 50 at a side of the wire supply section and a cut wire 50. The pair of strip blades 5F and 5R are disposed side by side in a supply direction of the wire 50 so as to hold the wire cutting blade 5C therebetween. In the cutter unit 5, at the side of a crimp machine for processing the end portion closer to the cut wire 50, a suction port 31 of a suction tube 30 for sucking the coatings 51 stripped by the pair of strip blades 5F and 5R is disposed.
申请公布号 JP2014176248(A) 申请公布日期 2014.09.22
申请号 JP20130048832 申请日期 2013.03.12
申请人 SHIN MEIWA IND CO LTD 发明人 FUJITA SEIICHIRO
分类号 H02G1/12;H01B13/00;H01B13/012;H01R43/05;H01R43/052 主分类号 H02G1/12
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