发明名称 COPPER ALLOY-PLASTICIZED MATERIAL FOR ELECTRONIC/ELECTRIC APPLIANCES, COMPONENT FOR ELECTRONIC/ELECTRIC APPLIANCES, AND TERMINAL
摘要 PROBLEM TO BE SOLVED: To provide a copper alloy-plasticized material for electronic/electric appliances consisting of a Cu-Ti alloy, capable of exhibiting sufficient strengths even if the Ti content thereof is low and of securing high electroconductivity and strengths, and suitable for electronic/electric components such as connectors and other terminals, relays, etc.SOLUTION: The provided material has a composition including Ti within a range of 0.5 mass% or above and 3.5 mass% or below in a state where the balance thereof consists of Cu and inevitable impurities, is manufactured by a finish rolling step of performing a finishing cold or hot roll at a rolling ratio exceeding 90% and an aging heat treatment step performed after this finish rolling step, and acquires a lamellar texture after the aging heat treatment.
申请公布号 JP2014173145(A) 申请公布日期 2014.09.22
申请号 JP20130047181 申请日期 2013.03.08
申请人 MITSUBISHI MATERIALS CORP ; UNIV OF ELECTRO-COMMUNICATIONS 发明人 MIURA HIROMI ; ITO YUKI ; MAKI KAZUMASA ; MORI HIROYUKI ; NAKAZATO YOSUKE
分类号 C22C9/00;C22F1/00;C22F1/08 主分类号 C22C9/00
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