CARRIER-PROVIDED COPPER FOIL, METHOD OF PRODUCING CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE AND METHOD OF PRODUCING PRINTED WIRE BOARD

摘要

PROBLEM TO BE SOLVED: To provide carrier-provided copper foil which has high adhesion between a carrier and an ultrathin copper layer before a step of laminating on an insulated substrate, does not cause extreme increase or decrease of the adhesion between the carrier and the ultrathin copper layer in the step of laminating on the insulated substrate, allows easy peeling in the carrier/ultrathin copper layer boundary surface and has good etching properties of the ultrathin copper layer.SOLUTION: An intermediate layer of carrier-provided copper foil contains Cr. When an insulated substrate is adhered to an ultrathin copper layer by thermal compression in the atmosphere in conditions of a pressure of 20 kgf/cmand a duration of 220°C×2 h and the carrier is peeled by the method of JIS C 6471, the adhesion amount of Cr remaining on the surface of the ultrathin copper layer on the intermediate layer side is 1-40 μg/dm.