| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive substrate by which a conductive substrate having an adequately low resistance can be obtained even in the case of forming a thin metal wiring pattern by baking at a low temperature which never damages a transparent resin substrate.SOLUTION: A method for manufacturing a conductive substrate according to the invention comprises the steps of: forming a thin metal wiring pattern on a transparent resin substrate by pattern printing by a printing method with an ink composition including metal nano particle dispersoid and an infrared absorbing pigment having an absorption maximum wavelength within a range of 900-1200 nm; and applying infrared light to the thin metal wiring pattern by use of an infrared light source having a light source filament temperature within a range of 1800-3600 K, thereby baking. |
