| 摘要 |
An objective of the present invention is to provide a support member capable of preventing substrate bending during a thermal treatment, especially when forming a film; and an apparatus to manufacture a semiconductor. The support member has: a placement unit having a first surface to place a first treatment object and a second surface to place a second treatment object; and a wall having a first portion formed on a portion of an outer circumference formed along the placement unit, while being protruded more vertically than the first treatment object placed on the first surface. The inner circumference of the first part of the wall is formed into a tapered form which can maintain and support the first treatment object by the first part of the wall. |
