PICK UP APPARATUS OF CHIP MOUNTER

摘要

The present invention relates to a pickup apparatus of a chip mounter which can automatically bond a device on a frame by using a mechanical apparatus to obtain not only convenience and promptness of work, but also accuracy of work. The apparatus comprises a vertical axis with a suction hole inside an apparatus body; a lifting work unit lifting the vertical axis up and down; a rotating work unit make the vertical axis be rotated left and right without interference of a horizontal motion; and a pickup tool combined with the end of the vertical axis to absorb a light emitting device with a vacuum suction force.