| 发明名称 |
WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS |
| 摘要 |
<p>In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.</p> |
| 申请公布号 |
WO2014140796(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
WO2014IB00716 |
申请日期 |
2014.03.13 |
| 申请人 |
COOLEDGE LIGHTING, INC. |
发明人 |
TISCHLER, MICHAEL, A. |
| 分类号 |
H01L21/50;H01L23/31;H01L25/00;H01L33/06;H01L33/26;H01L33/50 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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