| 发明名称 |
Chip Package with Isolated Pin, Isolated Pad or Isolated Chip Carrier and Method of Making the Same |
| 摘要 |
A chip package with isolated pin, isolated pad or isolated chip carrier and a method of making the same are disclosed. In one embodiment a chip package includes a chip, a package encapsulating the chip, pads or pins disposed on a first side of the package and an isolation pad or an isolation pin disposed on a second side of the package, the isolation pin or the isolation pad electrically isolated from the chip, wherein the chip comprises a magnetic field sensor configured to measure a magnetic field generated outside of the package. |
| 申请公布号 |
US2014264677(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313797724 |
申请日期 |
2013.03.12 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Ausserlechner Udo |
| 分类号 |
H01L29/82;H01L21/50 |
主分类号 |
H01L29/82 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package comprising:
a chip; a package encapsulating the chip; pads or pins disposed on a first side of the package; and an isolation pad or an isolation pin disposed on a second side of the package, the isolation pin or the isolation pad electrically isolated from the chip, wherein the chip comprises a magnetic field sensor configured to measure a magnetic field generated outside of the package. |
| 地址 |
Neubiberg DE |
