发明名称 |
Electronic Package Mounting |
摘要 |
An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package. |
申请公布号 |
US2014268605(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201313943833 |
申请日期 |
2013.07.17 |
申请人 |
Lockheed Martin Corporation |
发明人 |
Rovere Tom;Lake James K.;Micha Rick;Coyne Paul |
分类号 |
H05K1/18;F16J15/02;H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
|
主权项 |
1. An electronic package mounting assembly, the assembly comprising:
a printed circuit board assembly (PCBA) including a printed circuit board (PCB) comprising conductive pathways carried by a non-conductive substrate, and further comprising electrical PCB contacts carried by the PCB substrate and coupled with the conductive pathways; an electronic package carried by the PCB and comprising electrical package contacts on an underside of the package, the package contacts being in contact with the PCB contacts; and a gasket disposed between the underside of the package and the PCB substrate and surrounding the contacts, and shaped to fit around and under a perimeter edge of the package. |
地址 |
Bethesda MD US |