发明名称 Electronic Package Mounting
摘要 An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package.
申请公布号 US2014268605(A1) 申请公布日期 2014.09.18
申请号 US201313943833 申请日期 2013.07.17
申请人 Lockheed Martin Corporation 发明人 Rovere Tom;Lake James K.;Micha Rick;Coyne Paul
分类号 H05K1/18;F16J15/02;H05K3/30 主分类号 H05K1/18
代理机构 代理人
主权项 1. An electronic package mounting assembly, the assembly comprising: a printed circuit board assembly (PCBA) including a printed circuit board (PCB) comprising conductive pathways carried by a non-conductive substrate, and further comprising electrical PCB contacts carried by the PCB substrate and coupled with the conductive pathways; an electronic package carried by the PCB and comprising electrical package contacts on an underside of the package, the package contacts being in contact with the PCB contacts; and a gasket disposed between the underside of the package and the PCB substrate and surrounding the contacts, and shaped to fit around and under a perimeter edge of the package.
地址 Bethesda MD US