| 发明名称 |
WIRE BONDING APPARATUS AND METHOD |
| 摘要 |
A method of making an electrical connection includes passing a bond wire through a wire bonding system having a wire polisher and a wire bonding tool. The wire polisher removes contamination from a first portion of the bond wire. A first bond is then formed by bonding the first portion of the bond wire to a first contact such that the bond wire and the first device are electrically connected. A second bond is then formed by bonding a second portion of the bond wire to a second contact such that the first contact and the second contact are electrically connected. |
| 申请公布号 |
US2014263584(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313794836 |
申请日期 |
2013.03.12 |
| 申请人 |
Yap Jia Lin;Au Yin Kheng;Eu Poh Leng;Leong Hung Yang;Ibrahim Mohd Rusli;Kalandar Navas Khan Oratti;Zul-Kifli Mohd Faizal |
发明人 |
Yap Jia Lin;Au Yin Kheng;Eu Poh Leng;Leong Hung Yang;Ibrahim Mohd Rusli;Kalandar Navas Khan Oratti;Zul-Kifli Mohd Faizal |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of making an electrical connection, comprising:
passing a bond wire through a wire bonding system comprising a wire polisher and a wire bonding tool; removing contamination from at least a first portion of the bond wire using the wire polisher; forming a first bond by wire bonding the first portion of the bond wire to a first contact such that the bond wire and the first contact are electrically connected; and forming a second bond by wire bonding a second portion of the bond wire to a second contact such that the first contact and the second contact are electrically connected. |
| 地址 |
Klang MY |
