CYCLICAL PHYSICAL VAPOR DEPOSITION OF DIELECTRIC LAYERS

摘要

Embodiments include methods of forming dielectric layers. According to an exemplary embodiment, a dielectric layer may be formed by determining a desired thickness of the dielectric layer, forming a first dielectric sub-layer having a thickness less than the desired thickness by depositing a first metal layer above a substrate and oxidizing the first metal layer, and forming n (where n is greater than 1) additional dielectric sub-layers having a thickness less than the desired thickness above the first dielectric sub-layer by the same method of the first dielectric sub-layer so that a combined thickness of all dielectric sub-layers is approximately equal to the desired thickness.

主权项

1. A method of forming a dielectric layer, the method comprising:
determining a desired thickness of the dielectric layer; forming a first dielectric sub-layer having a thickness less than the desired thickness, wherein forming the first dielectric sub-layer comprises depositing a first metal layer above a substrate and oxidizing the first metal layer; and forming n additional dielectric sub-layers, each of which having a thickness less than the desired thickness, above the first dielectric sub-layer so that a combined thickness of all dielectric sub-layers is approximately equal to the desired thickness, wherein n is a number greater than 1 and each of the additional dielectric sub-layers is formed by depositing an additional metal layer above the preceding dielectric sub-layer and oxidizing the additional metal layer.