| 摘要 |
The present disclosure relates to thermoelectric devices which may be useful for a wide range of thermoelectric applications, for example, high temperature thermoelectric generation and fluid conditioning. Thermoelectric devices may include one or more heat exchanger(s) (e.g., coolant heat exchanger(s)) and one or more thermoelectric layers located adjacent (e.g., on opposite sides) to the heat exchanger(s). The thermoelectric layer(s) and the heat exchanger(s) may be surrounded by an enclosure, which provides a barrier from outside fluid (e.g., hot fluid flow). |
