| 发明名称 |
THERMOSETTING RESIN COMPOSITIONS WITH LOW COEFFICIENT OF THERMAL EXPANSION |
| 摘要 |
Thermosetting resin compositions with low coefficient of thermal expansion are provided herein. |
| 申请公布号 |
US2014264822(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313840171 |
申请日期 |
2013.03.15 |
| 申请人 |
HENKEL CORPORATION |
发明人 |
Horikiri Masashi;Bai Jie |
| 分类号 |
C08K5/101;H01L21/56;H01L23/29 |
主分类号 |
C08K5/101 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermosetting resin composition, comprising:
(a) a thermosetting resin component; (b) a curative; and (c) a lactone-modified silica filler. |
| 地址 |
Rocky Hill CT US |
