发明名称 THERMAL CONTROL OF DEVICE USING FLUID COOLANT
摘要 Assemblies, methods, and systems for controlling the temperature of an electronic device are described. One method includes positioning an electronic device in a chamber and electrically coupling a probe to the electronic device. The method also includes flowing a fluid in contact with the electronic device at a flow rate, the fluid comprising a liquid. A current is applied to the probe to carry out an electronic device testing operation, and a temperature of the electronic device is monitored during the electronic testing operation. The method may also include determining whether a change to the flow rate or temperature is necessary based on the monitored temperature of the electronic device. In one aspect of certain embodiments, the electronic device may be positioned so that each of the sides of the electronic device may be at least partially in contact with the fluid during the electronic device testing operation.
申请公布号 US2014262129(A1) 申请公布日期 2014.09.18
申请号 US201313844192 申请日期 2013.03.15
申请人 LI Zhihua;KIRBY Ronald M.;WALCZYK Joe F.;LOFGREEN Kelly P. 发明人 LI Zhihua;KIRBY Ronald M.;WALCZYK Joe F.;LOFGREEN Kelly P.
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项 1. A method for controlling the temperature of an electronic device, comprising: positioning an electronic device in a chamber; electrically coupling a probe to the electronic device; flowing a fluid in contact with the electronic device at a flow rate; applying a current to the probe to carry out an electronic device testing operation; monitoring a temperature of the electronic device during the electronic testing operation; and determining whether a change to the flow rate is necessary based on the monitored temperature.
地址 Chandler AZ US