发明名称 |
PRINTED CIRCUIT BOARD WITH INTEGRATED COIL, AND MAGNETIC DEVICE |
摘要 |
In this printed circuit board (3) with an integrated coil, conductive coil patterns (4a through 4e) are formed on a plurality of layers (L1 through L3) and conductive heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) are provided on a bottom outer layer (L3) so as to correspond to coil patterns (4a through 4d) on a top outer layer (L1) and an inner layer (L2). Each heat-dissipating pattern (5a7 through 5a9, 5b7 through 5b9) is kept separate from the other heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) and the coil pattern (4e) on the bottom outer layer (L3). Corresponding coil patterns (4a through 4d) and heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) are connected by conductive heat-dissipating pins (7a through 7f), pads (8c), and through-holes (8). |
申请公布号 |
WO2014141673(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
WO2014JP01327 |
申请日期 |
2014.03.10 |
申请人 |
OMRON AUTOMOTIVE ELECTRONICS CO., LTD. |
发明人 |
HACHIYA, KOJI;KOBAYASHI, TOMOYOSHI;NAKABAYASHI, KOICHI |
分类号 |
H01F37/00;H01F17/00;H01F17/04;H01F27/08;H01F27/22;H01F27/28;H05K1/02 |
主分类号 |
H01F37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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