METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SHEET-LIKE RESIN COMPOSITION, AND DICING TAPE INTEGRATED SHEET-LIKE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of suppressing dissolution of a sheet-like resin composition adhered to a surface of a wafer with a support when the support is separated from the wafer with the support in which the wafer is bonded to the support through a temporary joint layer.SOLUTION: A method for manufacturing a semiconductor device comprises: a step A for preparing a wafer with a support in which the support is bonded to one surface of the wafer where a through electrode is formed thereon, through a temporary joint layer; a step B for preparing a dicing tape integrated sheet-like resin composition in which a sheet-like resin composition having an outer shape being smaller than an other surface of the wafer, is formed on a dicing tape; a step C for adhering the other surface of the wafer with the support to the sheet-like resin composition of the dicing tape integrated sheet-like resin composition; and a step D for separating the support from the wafer by dissolving the temporary layer with a solvent.