发明名称 COMPOSITE SHEET FOR PROTECTIVE FILM FORMATION, METHOD FOR PRODUCING COMPOSITE SHEET FOR PROTECTIVE FILM FORMATION, AND METHOD FOR PRODUCING CHIP WITH PROTECTIVE FILM
摘要 <p>[Problem] To provide a composite sheet for protective film formation, which has good holding power with respect to a jig such as a ring frame and excellent releasability at the time of pick-up, and which is capable of preventing defects that are caused by decrease in adhesion between a second adhesive layer and an adhesive layer (a first adhesive layer) of an adhesive sheet. [Solution] A composite sheet for protective film formation according to the present invention comprises a film for protective film formation on a first adhesive layer of an adhesive sheet, which comprises a base and the first adhesive layer as constituent layers, with a second adhesive layer being interposed therebetween. The shape of the second adhesive layer is contained in the shape of the adhesive sheet when viewed in plan; the first adhesive layer is formed of an energy ray-curable adhesive or an adhesive that is obtained by curing an energy ray-curable adhesive; the second adhesive layer is formed of an adhesive that is obtained by curing an energy ray-curable adhesive; and the tensile modulus of the second adhesive layer at 25°C is 200-2,000 MPa.</p>
申请公布号 WO2014142151(A1) 申请公布日期 2014.09.18
申请号 WO2014JP56436 申请日期 2014.03.12
申请人 LINTEC CORPORATION 发明人 TAKANO, KEN;KABUTO, AKIO
分类号 H01L21/301;B32B27/00;B32B27/16;C09J7/02;C09J11/06;C09J201/00 主分类号 H01L21/301
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