| 发明名称 |
Adhesion between Post-Passivation Interconnect Structure and Polymer |
| 摘要 |
An embodiment integrated circuit structure includes a substrate, a metal pad over the substrate, a post-passivation interconnect (PPI) structure over the substrate and electronically connected to the metal pad, a thin oxide film layer directly over a top surface of the PPI structure, and a polymer layer over the thin oxide film layer and PPI structure. |
| 申请公布号 |
US2014264853(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313800653 |
申请日期 |
2013.03.13 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Lin Jing-Cheng;Hung Jui-Pin;Lin Min-Chen;Lin Yi-Hang |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit structure comprising:
a substrate; a metal pad over the substrate; a post-passivation interconnect (PPI) structure over the substrate and electronically connected to the metal pad; a thin oxide film layer directly over a top surface of the PPI structure; and a polymer layer over the thin oxide film layer and PPI structure. |
| 地址 |
Hsin-Chu TW |
