| 发明名称 |
CHIP CARD INLAY FOR CONTACT-ACTIVATED AND CONTACTLESSLY ACTIVATED CHIP CARDS |
| 摘要 |
Chip card inlay for contact-activated and contactlessly activated chip cards, having a planar substrate layer made of a non-conductive plastics material, on which an antenna having, at its end, planar conductive pads for attaching a chip is fastened, wherein the conductive pads are formed from a textile fabric having thread crossings, and on each top side of the textile fabric an electrically conductive contact zone is provided which has a three-dimensionally conductive terminal pad structure with weave points of the textile fabric as topographical contact zone elevations. |
| 申请公布号 |
US2014263657(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414179091 |
申请日期 |
2014.02.12 |
| 申请人 |
SES RFID Solutions GmbH |
发明人 |
Scattergood Martin |
| 分类号 |
G06K19/077 |
主分类号 |
G06K19/077 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Chip card inlay for contact-activated and contactlessly activated chip cards, having a planar substrate layer made of a non-conductive plastics material, on which an antenna having, at its end, planar conductive pads for attaching a chip is fastened, wherein the conductive pads are formed from a textile fabric having thread crossings, and on each frace of the textile fabric an electrically conductive contact zone is provided which has a three-dimensionally conductive terminal pad structure with weave points of the textile fabric as topographical contact zone elevations. |
| 地址 |
Dusseldorf DE |
