发明名称 METHOD OF WATER REPELLENT TREATMENT FOR PATTERN SURFACE
摘要 Provided is a method of water repellent treatment for a pattern surface, the method including the steps of agitatingly mixing a perfluoropolyether-group-containing silane water repellent, an organic acid, a fluorine-containing solvent capable of dissolving the perfluoropolyether-group-containing silane water repellent and the organic acid, and water to hydrolyze the perfluoropolyether-group-containing silane water repellent, thereby obtaining a partial hydrolysate solution; forming a photosensitive resin layer on a substrate; applying the partial hydrolysate solution onto the photosensitive resin layer to form a water-repellent film; performing patterning exposure to the photosensitive resin layer and the water-repellent film; performing heat treatment to collectively cure an exposed portion of the photosensitive resin layer and the water-repellent film; and removing a non-exposed portion of the photosensitive resin layer and the water-repellent film by development treatment to form a pattern.
申请公布号 US2014272725(A1) 申请公布日期 2014.09.18
申请号 US201414189018 申请日期 2014.02.25
申请人 CANON KABUSHIKI KAISHA 发明人 Hamade Yohei;Sawada Etsuko;Ikegame Ken;Mihara Hiroaki;Tsutsui Satoshi
分类号 G03F7/16 主分类号 G03F7/16
代理机构 代理人
主权项 1. A method of water repellent treatment for a pattern surface, the method comprising the steps of: a) agitatingly mixing a perfluoropolyether-group-containing silane water repellent, an organic acid, a fluorine-containing solvent capable of dissolving the perfluoropolyether-group-containing silane water repellent and the organic acid, and water to hydrolyze the perfluoropolyether-group-containing silane water repellent, thereby obtaining a partial hydrolysate solution; b) forming a photosensitive resin layer on a substrate; c) applying the partial hydrolysate solution onto the photosensitive resin layer to form a water-repellent film; d) performing patterning exposure to the photosensitive resin layer and the water-repellent film; e) performing heat treatment to collectively cure an exposed portion of the photosensitive resin layer and the water-repellent film; and f) removing a non-exposed portion of the photosensitive resin layer and the water-repellent film by development treatment to form a pattern.
地址 Tokyo JP
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