SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY MODULE PACKAGING

摘要

Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.

主权项

1. A method comprising:
performing quality control review for a plurality of electronic modules, each electronic module including a functional assembly of electronic components, and the quality control review including at least a first test phase; for each module determined to have failed the first test phase and responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase, performing an electronic current leakage screening for each module determined to have passed the first test phase, wherein the leakage screening excludes each module determined to have failed the first test phase.