| 摘要 |
The invention relates to an electronic sub-assembly comprising a carrier layer and a component region with at least one electronic component, the carrier layer having, at least in sections, a material with a low coefficient of thermal expansion to adapt the coefficient of thermal expansion of the carrier layer, and the carrier layer, in addition to the component region, having at least one compensation layer on which an electrically insulating, thermally conducting layer and at least one electrically conductive layer are provided. |
