| 摘要 |
The semiconductor device includes an oxide semiconductor layer including a plurality of channel formation regions arranged in the channel width direction and parallel to each other and a gate electrode layer covering a side surface and a top surface of each channel formation region with a gate insulating layer placed between the gate electrode layer and the channel formation regions. With this structure, an electric field is applied to each channel formation region from the side surface direction and the top surface direction. This makes it possible to favorably control the threshold voltage of the transistor and improve the S value thereof. Moreover, with the plurality of channel formation regions, the transistor can have increased effective channel width; thus, a decrease in on-state current can be prevented. |
