| 摘要 |
<p>A multilayer chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface, a counterbore opening, and a polishing layer interfacial region parallel to the polishing surface; a porous sub pad layer having a bottom surface and a porous sub pad layer interfacial region parallel to the bottom surface; and an endpoint detection window block with a broad spectrum. The polishing layer interfacial region and the porous sub pad layer interfacial region form a coextensive region. The multilayer chemical mechanical polishing pad has a through opening that is extended from the polishing surface to the bottom surface of the porous sub pad layer. The counterbore opening opens on the polishing surface, enlarges the through opening, and forms a ledge. The endpoint detection window block with a broad spectrum is disposed within the counterbore opening.</p> |
