FABRICATION METHODS OF THERMOELECTRIC THIN FILM MODULES USING MOULDS CONSISTING OF VIA-HOLES AND THERMOELECTRIC THIN FILM MODULES PRODUCED USING THE SAME METHOD

摘要

The present invention relates to a thermoelectric thin film module. In particular, the present invention provides a method for manufacturing a thermoelectric thin film module, and a thermoelectric thin film module manufactured by the same. The method is characterized in that thermoelectric thin film legs in an n type and in a p type are formed by using a mold having via-holes so as to simplify a manufacturing method, to enhance properties of the module, and to increase reliability of the module.