发明名称 Suspension board with circuit
摘要 A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region.
申请公布号 US8835767(B2) 申请公布日期 2014.09.16
申请号 US201213360224 申请日期 2012.01.27
申请人 Nitto Denko Corporation 发明人 Ishigaki Saori;Kanagawa Hitoki;Fujimura Yoshito
分类号 H05K1/00;G11B5/48 主分类号 H05K1/00
代理机构 Edwards Neils PLLC 代理人 Edwards Jean C.;Edwards Neils PLLC
主权项 1. A suspension board with circuit comprising: an insulating base layer; and a conductive pattern that is laminated on a top surface of the insulating base layer, wherein the conductive pattern includes: a wire, and a terminal portion that is connected to the wire for being joined by a melted metal, wherein the insulating base layer, when viewing a sectional cut taken in a thickness direction which is perpendicular to a lengthwise direction and a widthwise direction of the suspension board with circuit, includes: a recess disposed in a bottom surface of the insulating base layer so as to form an adjacent region that is adjacent to the terminal portion, anda separated region that is separated from the terminal portion so as to sandwich the adjacent region between the terminal portion and the separated region, wherein the adjacent region is formed to be thinner than the separated region in the thickness direction, and wherein at least one lateral edge portion of the thinner adjacent region protrudes beyond an outermost lateral edge of the conductive pattern in the lengthwise direction of the suspension board with circuit.
地址 Osaka JP