| 摘要 |
A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (10) operating in an exposure workstation (6) and a silicon chip stage (12) operating in a pre-processing workstation (7). Each silicon chip stage (10, 12) is supported by a six-freedom micro-motion stage, respectively. The silicon chip stage (10, 12) and the six-freedom micro-motion stage form a silicon chip stage group. The two silicon chip stage groups are provided on the same rectangular base stage (1) and suspended on an upper surface (2) of the base sage by air bearings. A double-freedom driving unit (21a, 21b, 22a, 22b) is provided on each edge of the base stage (1), respectively. The six-freedom micro-motion stage of the silicon chip stage group has an upper layer driver and a lower layer driver, capable of achieving six-freedom control. The double-freedom driving units (21a, 21b) on the long edges of the base stage are connected with the bases (62) of the six-freedom micro-motion stages, and the double-freedom driving units (22a, 22b) on the short edges of the base stage are connected with the stator coils (63) of the upper layer drivers of the six-freedom micro-motion stages. |
| 主权项 |
1. A dual-stage exchange system for a lithographic apparatus, the system comprising, a first wafer stage (10) operating at an exposure workstation (6) and a second wafer stage (12) operating at a pre-processing workstation (7), each of the wafer stages being borne by a 6-DOF micro-positioner respectively, a wafer stage and a 6-DOF micro-positioner constituting a stage group, the 6-DOF micro-positioner being driven by Lorentz motors, said two wafer stages being disposed on a top surface (2) of a rectangular base with its long sides in X direction and its short sides in Y direction, a first X 2-DOF driving unit (21a) and a second X 2-DOF driving unit (21b) being disposed on two long sides of the base (1) respectively and a first Y 2-DOF driving unit (22a) and a second Y 2-DOF driving unit (22b) being disposed on two short sides of the base (1) respectively, the 2-DOF driving units being driven by upper linear motors and lower linear motors, characterized in that: the 6-DOF micro-positioner of each stage group has upper and under layers of drivers with the upper layer being horizontal direction driver and the under layer being vertical direction driver, the upper layer driver allows movements in X direction, in Y direction and rotation about Z axis, the under layer driver allows movement in Z direction, rotation about X axis and rotation about Y axis; a base of the 6-DOF micro-positioner (62) is fixed with a pushrod (35) of the first X 2-DOF driving unit (21a), and a stator coil (63) of the upper layer driver of the 6-DOF micro-positioner is fixed with a pushrod (35) of the first Y 2-DOF driving unit (22a);
the exchange process for the two wafer stages of the system is as follows: upon exchange, firstly, stator coils (63) of upper layer drivers of the two stage groups' 6-DOF micro-positioners separate completely from rotor magnetic steels (64) of corresponding upper layer drivers respectively, the stator coils (63) of upper layer drivers of the two 6-DOF micro positioners are not exchanged, the two wafer stages exchange positions, then, the stator coil (63) of the upper layer driver of the 6-DOF micro-positioner located at the exposure workstation is inserted into a gap of the rotor magnetic steel (64) of the upper layer driver of the 6-DOF micro-positioner that moved to the exposure workstation, the stator coil (63) of the upper layer driver of the 6-DOF micro-positioner located at the pre-processing workstation is inserted into a gap of the rotor magnetic steel (64) of the upper layer driver of the 6-DOF micro-positioner that moved to the pre-processing workstation, after that the system enters a next operating cycle. |
