| 摘要 |
<p>A heat dissipation device of electronic apparatus, which is applicable to an electronic apparatus with a heat source for dissipating heat. The heat dissipation device includes: at least one electroconductive heat conduction plate assembly having a contact face in contact with a grounding surface and a heat conduction face facing the heat source; and a heat spreader with an area smaller than that of the heat conduction plate assembly. The heat spreader is able to transversely conduct heat. The heat spreader is attached to the heat conduction plate assembly. The heat spreader has a proximal-to-heat-source section proximal to the heat source and a distal-from-heat-source section extending in a direction away from the heat source. The heat conduction plate assembly and the heat spreader cooperate with each other to conduct and spread the heat of the heat source in different directions.</p> |
