PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

The present invention relates to a photosensitive resin composition which contains (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator, (C) a thiol group-containing compound and (E) a photopolymerizable compound. The component (A) contains at least one kind of acid-modified vinyl group-containing epoxy resin (A1) which is obtained from a bisphenol novolac epoxy resin (a1) having a constituent unit represented by general formula (IV) or (V) and an acid-modified vinyl group-containing epoxy resin (A2) which is obtained from an epoxy resin (a2) that is different from the epoxy resin (a1).