PALLADIUM COATED COPPER WIRE FOR BONDING APPLICATIONS

摘要

The invention is related to a bonding wire, comprising a core (2) with a surface, wherein the core comprises copper as a main component, and a coating layer (3) superimposed over the surface of the core (2), wherein the coating layer (3) comprises palladium as a main component, wherein the core (2) comprises at least 5 wt.ppm silver and at least 20 wt. ppm phosphorus as further components, wherein the wire meets the relation 0.0008 < E/(d*CP) < 0.0375, wherein E is an elongation of the wire measured in %, d is a diameter of the wire measured in μm and CP is the phosphorus content of the wire core measured in wt. ppm.