发明名称 |
MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING |
摘要 |
A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant- cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold. |
申请公布号 |
WO2014136007(A1) |
申请公布日期 |
2014.09.12 |
申请号 |
WO2014IB59084 |
申请日期 |
2014.02.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED;IBM JAPAN LIMITED |
发明人 |
CAMPBELL, LEVI;ELLSWORTH, MICHAEL;ARVELO, AMILCAR;MCKEEVER, ERIC, JAMES |
分类号 |
H01L23/40;H01L23/36;H01L25/04;H01L25/18 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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