| 摘要 |
In the present invention, misalignment of a ceramic plate, a joining material, and a copper circuit board when said copper circuit board is being joined to the ceramic plate via active-metal brazing is prevented and a plurality of power-module substrates are manufactured efficiently. A method for manufacturing a plurality of power-module substrates by joining a plurality of copper circuit boards (30), with spaces therebetween, to a ceramic plate (21) that is large enough for a plurality of ceramic substrates to be formed side-by-side and then segmenting the ceramic plate (21) between the copper circuit boards (30). Joining-material layers (71), each of which comprises an active brazing filler metal and has the same external shape as the copper circuit boards (30), are formed on the ceramic plate (21). Also, a temporary affixing material (72) consisting primarily of polyethylene glycol is applied to the copper circuit boards (30). Using said temporary affixing material (72), the joining-material layers (71) and the copper circuit boards (30) are positioned on top of the ceramic plate (21) and temporarily affixed thereto in a layered state, and the resulting layered body is heated and subjected to pressure in the layering direction so as to join the copper circuit boards to the ceramic plate. |
