| 摘要 |
The invention comprises the steps of -a) Providing a first substrate (1) covered by a metal layer (2) and a second substrate (3) covered by a metal layer (4), -b) Bringing the metal layers (2, 4) into direct contact in such a way as to form a bonding interface (6) comprising metal material bridges (5) separated by cavities fluidly connected together, -d) Submerging the bonding interface (6) in an oxidising fluid (8) in such a way as to form a metal oxide at least partially filling the cavities and metal/metal oxide/metal contact areas (9). The invention also concerns a structure (100) comprising a first substrate (1), a first metal layer (2), a second metal layer (4) forming a bonding interface (6) with the first metal layer (2), and a second substrate (3), the bonding interface (6) comprising metal material bridges (5) separated by cavities, a metal oxide at least partially filling the cavities and metal/metal oxide/metal contact areas (9). |
