Anchor Vias for Improved Backside Metal Adhesion to Semiconductor Substrate

摘要

Disclosed is a structure having anchor vias for improved backside metal adhesion and an associated method for the structure's fabrication. The structure includes at least one anchor via disposed in at least one corner of a semiconductor substrate. A metal filler may be formed within the at least one anchor via, the metal filler having a protruding portion extending from a backside of the semiconductor substrate. The structure may further include a backside metal layer on a bottom surface of the semiconductor substrate, the backside metal layer being bonded to the protruding portion of the metal filler in the at least one anchor via. The at least one anchor via may include a cluster of anchor vias, a plurality of anchor vias disposed in a straight line and/or in a staggered configuration along a periphery of the semiconductor substrate.

主权项

1. A structure comprising:
at least one anchor via disposed in at least one corner of a semiconductor substrate; a metal filler within said at least one anchor via, said metal filler having a protruding portion extending from a backside of said semiconductor substrate; a backside metal layer on a bottom surface of said semiconductor substrate, said backside metal layer being bonded to said protruding portion of said metal filler of said at least one anchor via.