摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and device for observing defects using a charged particle beam system.SOLUTION: Buried defects on a substrate 122 are observed using charged particle beams. The defects found are imaged by milling a series of slices and performing a light, preferential etch to provide a topographical interface between materials having similar secondary electron emission characteristics. The slices are sufficiently small to capture small defects, but are sufficiently large to overcome problems with redeposition.</p> |