| 发明名称 |
CAMERA MODULE |
| 摘要 |
In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion. |
| 申请公布号 |
US2014252522(A1) |
申请公布日期 |
2014.09.11 |
| 申请号 |
US201414155308 |
申请日期 |
2014.01.14 |
| 申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
MIYAZAKI Masashi;SUGIYAMA Yuichi;SAWATARI Tatsuro;YOKOTA Hideki;HATA Yutaka |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A camera module, comprising:
an imaging device mounted on an insulating portion of a substrate; and a lens arranged above the imaging device, wherein a planar part is embedded in the insulating portion of the substrate so as to face the imaging device, the planar part mitigating deformation of a surface of the insulating portion on which the imaging device is mounted. |
| 地址 |
Tokyo JP |
